Design, Analysis, Fabrication, and Characterization of the Micro Optical Scanning Devices

Presently, we successfully integrated multi-depth DRIE etching, two-poly MUMPs, and bulk releasing to accomplish superior poly-Si micro-optical systems. The stiffness of the devices was significantly increased using the trench-refilled rib structure, so that the radius of curvature (ROC) of the 2μm thick mirror even reached 150mm. In addition, the space between the devices and the substrate was remarkably increased to ~100μm by bulk silicon etching. Moreover, the self-aligned vertical comb actuators were available through the multi-depth DRIE etching. In application, the scanning mirrors driven by vertical comb actuator were demonstrated. These poly-Si micro-optical devices can further integrate with the MUMPs devices to establish a more powerful MOEMS platform.